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| SPI42N03S2L-13 SPP42N03S2L-13,SPB42N03S2L-13 OptiMOS(R) Buck converter series Feature * N-Channel Product Summary VDS RDS(on) ID P- TO263 -3-2 30 12.9 42 P- TO220 -3-1 V m A * Enhancement mode * Logic Level * Excellent Gate Charge x RDS(on) P- TO262 -3-1 product (FOM) * Superior thermal resistance * 175C operating temperature * Avalanche rated * dv/dt rated Type SPP42N03S2L-13 SPB42N03S2L-13 SPI42N03S2L-13 Package Ordering Code Marking 2N03L13 2N03L13 2N03L13 P- TO220 -3-1 Q67042-S4034 P- TO263 -3-2 Q67042-S4035 P- TO262 -3-1 Q67042-S4104 Maximum Ratings, at Tj = 25 C, unless otherwise specified Parameter Symbol Continuous drain current1) TC=25C Value 42 42 Unit A ID Pulsed drain current TC=25C I D puls EAS EAR dv/dt VGS Ptot T j , Tstg 248 110 8 6 20 83 -55... +175 55/175/56 kV/s V W C mJ Avalanche energy, single pulse ID=42A, VDD =25V, R GS=25 Repetitive avalanche energy, limited by Tjmax2) Reverse diode dv/dt IS=42A, VDS=24V, di/dt=200A/s, Tjmax=175C Gate source voltage Power dissipation TC=25C Operating and storage temperature IEC climatic category; DIN IEC 68-1 Page 1 2003-01-17 SPI42N03S2L-13 SPP42N03S2L-13,SPB42N03S2L-13 Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 3) Symbol min. RthJC RthJA - Values typ. 1.2 max. 1.8 62 40 Unit K/W Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Static Characteristics Drain-source breakdown voltage V GS=0V, I D=1mA Symbol min. V(BR)DSS VGS(th) I DSS I GSS RDS(on) RDS(on) 30 1.2 Values typ. 1.6 max. 2 Unit V Gate threshold voltage, VGS = VDS ID=37A Zero gate voltage drain current V DS=30V, V GS=0V, Tj=25C V DS=30V, V GS=0V, Tj=125C A 0.01 10 1 1 100 100 nA m 14.9 14.5 10.3 9.9 19.9 19.6 12.9 12.6 Gate-source leakage current V GS=20V, VDS=0V Drain-source on-state resistance V GS=4.5V, ID=21A V GS=4.5V, ID=21A, SMD version Drain-source on-state resistance4) V GS=10V, ID=21A V GS=10V, ID=21A, SMD version 1Current limited by bondwire ; with an R thJC = 1.8K/W the chip is able to carry I D= 64A at 25C, for detailed information see app.-note ANPS071E available at www.infineon.com/optimos 2Defined by design. Not subject to production test. 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. 4Diagrams are related to straight lead versions Page 2 2003-01-17 SPI42N03S2L-13 SPP42N03S2L-13,SPB42N03S2L-13 Electrical Characteristics Parameter Dynamic Characteristics Transconductance Input capacitance Output capacitance Reverse transfer capacitance Gate resistance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Inverse diode continuous forward current Inv. diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge ISM VSD trr Qrr VGS =0V, I F=42 VR =-V, IF=lS, diF /dt=100A/s Symbol Conditions min. Values typ. 42 850 330 90 1 6.5 12 24 14.5 max. - Unit g fs Ciss Coss Crss RG t d(on) tr t d(off) tf V DS2*I D*RDS(on)max, ID=42A V GS=0V, V DS=25V, f=1MHz 21 - S 1130 pF 330 130 9.8 18 36 21.8 ns V DD=15V, VGS=10V, ID=21A, RG=7.8 Q gs Q gd Qg V DD=24V, ID=21A - 2.7 7.9 22.9 3.5 3.6 11.9 30.5 - nC V DD=24V, ID=21A, V GS=0 to 10V V(plateau) V DD=24V, ID=21A V IS TC=25C - 0.95 24 18 42 248 A 1.25 V 31 23 ns nC Page 3 2003-01-17 SPI42N03S2L-13 SPP42N03S2L-13,SPB42N03S2L-13 1 Power dissipation Ptot = f (TC) 100 SPP42N03S2L-13 2 Drain current ID = f (TC) parameter: V GS 10 V 50 SPP42N03S2L-13 W A 80 70 60 50 40 30 20 10 0 0 100 120 140 160 C 190 40 35 P tot ID 20 40 60 80 30 25 20 15 10 5 0 0 20 40 60 80 100 120 140 160 C 190 TC TC 3 Safe operating area ID = f ( V DS ) parameter : D = 0 , TC = 25 C 10 3 SPP42N03S2L-13 4 Max. transient thermal impedance ZthJC = f (t p) parameter : D = t p/T 10 1 SPP42N03S2L-13 K/W A tp = 5.8s 10 0 10 s ID DS /I 10 D 2 ZthJC 100 s 10 -1 R DS (on ) = V D = 0.50 10 -2 0.20 0.10 10 1 1 ms 0.05 10 -3 single pulse 0.02 0.01 10 ms DC 10 0 -1 10 10 0 10 1 V 10 2 10 -4 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 VDS Page 4 tp 2003-01-17 SPI42N03S2L-13 SPP42N03S2L-13,SPB42N03S2L-13 5 Typ. output characteristic ID = f (VDS); Tj=25C parameter: tp = 80 s 110 SPP42N03S2L-13 Ptot = 83W 6 Typ. drain-source on resistance RDS(on) = f (ID) parameter: V GS 40 SPP42N03S2L-13 b c d A h 90 ge f VGS [V] a 3.0 b c d 3.5 4.0 4.5 5.0 5.5 6.0 10.0 m 32 80 RDS(on) 28 24 20 16 e f ID 70 60 50 40 30 20 10 0 0 0.5 1 1.5 2 2.5 3 3.5 b c d e f g h 12 8 VGS [V] = g h 4 a b 3.5 c 4.0 d 4.5 e f 5.0 5.5 g h 6.0 10.0 4 V 5 0 0 10 20 30 40 50 A 70 VDS ID 7 Typ. transfer characteristics ID= f ( VGS ); VDS 2 x ID x RDS(on)max parameter: tp = 80 s 100 8 Typ. forward transconductance g fs = f(ID); Tj=25C parameter: gfs 50 A 80 70 60 50 40 30 20 10 0 0 S 40 35 gfs 30 25 20 15 10 5 0 0 1 2 3 4 6 ID V VGS 10 20 30 40 50 60 70 80 A 100 ID Page 5 2003-01-17 SPI42N03S2L-13 SPP42N03S2L-13,SPB42N03S2L-13 9 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 21 A, VGS = 10 V SPP42N03S2L-13 10 Typ. gate threshold voltage VGS(th) = f (Tj) parameter: V GS = VDS 2.5 m 30 24 RDS(on) 22 20 18 16 14 12 10 8 6 4 2 0 -60 -20 20 60 100 140 C 0.8mA 1.5 98% 1 37uA typ 0.5 200 0 -60 -20 20 60 100 180 Tj 11 Typ. capacitances C = f (VDS) parameter: V GS=0V, f=1 MHz 10 4 12 Forward character. of reverse diode IF = f (VSD) parameter: Tj , tp = 80 s 10 3 SPP42N03S2L-13 pF A Ciss 10 3 10 2 C Coss Crss 10 2 10 1 Tj = 25 C typ Tj = 175 C typ Tj = 25 C (98%) Tj = 175 C (98%) 10 1 0 10 0 0 IF 5 10 15 20 V 30 0.4 0.8 1.2 1.6 2 2.4 V 3 VDS Page 6 VSD 2003-01-17 SPI42N03S2L-13 SPP42N03S2L-13,SPB42N03S2L-13 13 Typ. avalanche energy EAS = f (Tj) par.: ID =42A, VDD = 25 V, RGS = 25 120 14 Typ. gate charge VGS = f (QGate ) parameter: ID = 21 A pulsed SPP42N03S2L-13 16 mJ V 100 90 12 E AS 80 70 60 50 VGS 10 0,2 VDS max 0,8 VDS max 8 6 40 30 20 2 10 0 25 45 65 85 105 125 145 4 C 185 Tj 0 0 4 8 12 16 20 24 28 nC 36 Q Gate 15 Drain-source breakdown voltage V(BR)DSS = f (Tj) parameter: ID=10 mA SPP42N03S2L-13 36 V V(BR)DSS 34 33 32 31 30 29 28 27 -60 -20 20 60 100 140 C 200 Tj Page 7 2003-01-17 SPI42N03S2L-13 SPP42N03S2L-13,SPB42N03S2L-13 Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Further information Please notice that the part number is BSPP42N03S2L-13, BSPB42N03S2L-13 and BSPI42N03S2L-13, for simplicity the device is referred to by the term SPP42N03S2L-13, SPB42N03S2L-13 and SPI42N03S2L-13 throughout this documentation Page 8 2003-01-17 |
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